High-purity spherical copper powder for advanced applications
Spherical copper powder with particle size 5-100 microns. High purity 99.95% Cu content. Perfect spherical shape provides excellent flowability and uniform packing. Superior for additive manufacturing and 3D printing applications.
Used in additive manufacturing, 3D printing, conductive inks, thermal management systems, and high-precision electronic applications. Ideal for applications requiring excellent flowability and uniform particle distribution.
Store in dry, well-ventilated area. Protect from moisture and oxidizing agents.
Use protective equipment. Avoid inhalation of dust. Keep away from oxidizing agents.
LOW HAZARD - Metal powder with low reactivity. Standard metal handling procedures apply.
Standard metal powder regulations apply. No special permits required.
Particle size: 5-100 microns, Purity: 99.95%, Electrical conductivity: 5.96x10^7 S/m, Thermal conductivity: 401 W/mK, Shape: Spherical
| Chemical Formula | Cu |
| Molecular Weight | 63.55 g/mol |
| Density | 8.96 g/cm³ |
| Melting Point | 1085°C |
| Boiling Point | 2562°C |
| Detonation Velocity | N/A m/s |
| Impact Sensitivity | N/A |
| Friction Sensitivity | n/a |
| Electrostatic Sensitivity | Low |
| Water Solubility | Insoluble |
| Appearance | reddish-brown spherical powder |
| Odor | Odorless |
| Stability | stable under normal conditions |